Intra-Lid Multi-Core Vapor Chamber Architecture for Heterogeneous Electronic Packages: Technology Concept to Prototype Evaluation

Thermal management of future heterogeneous electronic packages with extreme heat fluxes relies on effective spreading in the package lid. Intra-lid integration vapor chambers is a promising strategy for simultaneous dissipation large total loads and localized high-flux hot spots. However, conventional comprising single core require relatively thick evaporator wicks to prevent dry out at high loads, thereby imposing temperature drop across wick spot location. We recently proposed cascaded multi-core chamber (CMVC) architecture single-core stacked an array smaller footprint cores having thinner wicks. The designed spread from arbitrarily distributed spots before they enter top thicker wick. Then, spreads base mounted sink. To evaluate CMVC technology, we make weighted decision identify appropriate minimum viable prototype subsequent design testing. A reduced-order model used determine dimensions properties that minimize down-selected given power map, considering manufacturing process constraints. Finite element analysis (FEA) simulations are employed decide condenser wall thickness avoids permanent deformation under mechanical load. manufactured by commercial vendor following these parameters As predicted thermal model, experimental characterization this first-reported offers notable reduction relative benchmark solid copper spreader, owing attenuation low difference.